N5单晶高温合金TLP扩散连接头的组织与性能Microstructure and property of transient liquid phase bonding joint of N5 single crystal superalloy
柴禄,黄继华,侯金保,郎波,王立
摘要(Abstract):
采用自制镍基非晶箔片KNi3A对N5单晶高温合金进行过渡液相扩散连接,连接工艺为真空环境中1513 K保温0.25~24 h,对性能样品进行标准热处理。利用扫描电镜对接头的组织结构进行观察和分析,研究焊缝组织随保温时间延长的变化规律,阐述焊缝和母材中γ'相长大和球化机制,并对接头进行高温持久性能测试。结果表明,接头区域由连接区、扩散区和母材区组成;随保温时间的延长,上述3区的界线由于等温凝固过程而逐步变得不明显,并最终得到趋于一致的微观组织,热处理后接头1000℃在125 MPa持久寿命可达母材的90%以上。
关键词(KeyWords): 单晶高温合金;过渡液相扩散连接;组织;性能
基金项目(Foundation):
作者(Author): 柴禄,黄继华,侯金保,郎波,王立
DOI: 10.13289/j.issn.1009-6264.2014.11.022
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