微连接用碳基纳米颗粒增强无铅复合钎料的研究新进展Reviews on latest advances in carbon-based nano-particles enhanced lead-free composite solders for electronic micro-connection
王悔改,张柯柯,尹宸翔,吴咏锦
摘要(Abstract):
综合评述含碳纳米管、石墨烯纳米片等碳基纳米颗粒增强微连接用无铅复合钎料的研究现状,介绍了碳纳米管、石墨烯纳米片、富勒烯、金属改性碳纳米管(石墨烯纳米片)等增强相对无铅钎料和钎焊接头组织与性能的影响。简述了无铅复合钎料的制备方法、熔化特性、导电性、润湿性、力学性能和无铅复合钎料焊点可靠性等,指出了碳基纳米颗粒增强无铅复合钎料存在的问题、解决措施及发展趋势。
关键词(KeyWords): 碳基纳米颗粒;无铅复合钎料;微连接;进展
基金项目(Foundation): 国家自然科学基金(U1604132);; 河南省教育厅自然科学研究项目(18A430014);; 国家国际科技合作专项(2014DFR50820);; 河南省科技创新杰出人才计划(154200510022)
作者(Author): 王悔改,张柯柯,尹宸翔,吴咏锦
DOI: 10.13289/j.issn.1009-6264.2019-0398
参考文献(References):
- [1] 邹贵生,闫剑锋,母凤文,等.微连接和纳连接的研究新进展[J].焊接学报,2011,32(4):107-112.ZOU Gui-sheng,YAN Jian-feng,MU Feng-wen,et al.Recent progress in microjoining and nanojoining[J].Transactions of the China Welding Institution,2011,32(4):107-112.
- [2] 张柯柯,郭兴东,王悔改.热冲击下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头组织与性能[J].稀有金属材料与工程,2017,46(5):1353-1358.ZHANG Ke-ke,GUO Xing-dong,WANG Hui-gai.Interfacial microstructure and mechanical properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joint under thermal shock[J].Rare Metal Materials and Engineering,2017,46 (5):1353-1358.
- [3] Wang Y L,Fang Z H,Ma N,et al.Wettability of SACR-xNi solder alloy on Cu leading wire with no-clean flux[J].Journal of Materials Science:Materials in Electronics,2017,28:94-99.
- [4] 王剑豪,薛松柏,吕兆萍,等.纳米颗粒增强无铅钎料的研究进展[J].材料导报,2019,33(7):2133-2145.WANG Jian-hao,XUE Song-bai,Lü Zhao-ping,et al.Present research status of lead-free solder reinforced by nanoparticles[J].Materials Review,2019,33(7):2133-2145.
- [5] Salvetat-Delmotte J P,Rubio A.Mechanical properties of carbon nanotubes:a fiber digest for beginners[J].Carbon,2002,40:1729-1734.
- [6] Miracle D B.Metal matrix composites-From science to technological significance[J].Composites Science and Technology,2005,65:2526-2540.
- [7] 陈光.SAC305-X复合钎料性能及电热迁移行为研究[D].武汉:华中科技大学,2017.CHEN Guang.Research on basic properties,electro- and thermomigration performance of SAC305-X composite solders[D].Wuhan:Huazhong University of Science and Technology,2017.
- [8] Chernogorova O,Drozdova E,Ovchinnikova I,et al.Structure and properties of superelastic hard carbon phase created in fullerene-metal composites by high temperature-high pressure treatment[J].Journal of Applied Physics,2012,111:112601-112605.
- [9] Nai S M L,Wei J,Gupta M.Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes[J].Materials Science and Engineering A,2006,423:166-169.
- [10] Xu S,Chan Y C,Zhang K L,et al.Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing[J].Journal of Alloys and Compounds,2014,595:92-102.
- [11] Kim S H,Choi J P,Eom Y S,et al.A phenomenological study of a Sn-Ag-Al composite solder reinforced with Mg-MWCNT:Improved electrical conductivity and thermo-physical performance[J].Materials and Design,2018,140:196-208.
- [12] Chen G,Wu F S,Liu C Q,et al.Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets[J].Journal of Alloys and Compounds,2016,656:500-509.
- [13] Chen G,Liu L,Silberschmidt V V,et al.Microstructural evolution of 96.5Sn-3Ag-0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient[J].Journal of Materials Science:Materials in Electronics,2018,29:5253-5263.
- [14] Khodabakhshi F,Sayyadi R,Javid N S.Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying:Microstructural evolution and mechanical durability[J].Materials Science and Engineering A,2017,702:371-385.
- [15] Huo F P,Zhang K K,Zhang M,et al.The interfacial intermetallic and shear strength of Ni nanoparticle-decorated reduced graphene oxide reinforced Sn2.5Ag0.5Cu lead-free composite soldering joints[J].Advanced Engineering Materials,2018,20:1800147.
- [16] Wang H G,Zhang K K,Zhang M.Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder[J].Journal of Alloys and Compounds,2019,781:761-772.
- [17] 张柯柯,霍福鹏,王悔改,等.一种基于干法的石墨烯表面改性方法:中国,CN106829949B[P] 2018-12-21.
- [18] Jing H Y,Guo H J,Wang L X,et al.Influence of Ag-modified graphene nanosheets addition into SnAgCu solders on the formation and growth of intermetallic compound layers[J].Journal of Alloys and Compounds,2017,702:669-678.
- [19] Xu L Y,Zhang S T,Jing H Y,et al.Indentation size effect on Ag nanoparticle-modified graphene/Sn-Ag-Cu solders[J].Journal of Electronic Materials,2018,47(1):612-619.
- [20] Zhang M,Zhang K K,Huo F P,et al.Microstructures and properties of Sn2.5Ag0.7Cu0.1RE composite solders reinforced with Cu-coated graphene nanosheets synthesized by pyrolysis[J].Materials,2019,12:289.
- [21] Sobhy M,El-Refai A M,Fawzy A.Effect of graphene oxide nano-sheets (GONSs) on thermal,microstructure and stress-strain characteristics of Sn-5 wt%Sb-1 wt%Ag solder alloy[J].Journal of Materials Science:Materials in Electronics,2015,27(3):2349-2359.
- [22] Ma D L,Wu P.Effects of coupled stressing and solid-state aging on the mechanical properties of graphene nano sheets reinforced Sn-58Bi-0.7Zn solder joint[J].Materials Science and Engineering A,2016,651:499-506.
- [23] 徐连勇,刘向东,韩永典,等.石墨烯增强无铅焊料及其制备方法:中国,CN102581504A[P].2012-07-18.
- [24] 修子扬,武高辉,黄奕龙,等.一种电子封装用高强度复合钎料及其制备方法:中国,CN104842089A[P].2015-08-18.
- [25] Choi E K,Lee K Y,Oh T S.Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition process[J].Journal of Physics and Chemistry of Solids,2008,69:1403-1406.
- [26] Zhang S H,Chen Q F.Fabrication of MWCNT incorporated Sn-Bi composite[J].Composites:Part B,2014,58:275-278.
- [27] Peng Y T,Deng K.Fabrication of reduced graphene oxide nanosheets reinforced Sn-Bi nanocomposites by electro-chemical deposition[J].Composites:Part A,2015,73:55-62.
- [28] Peng Y T,Hu Y R,Han L Z,et al.Ultrasound-assisted fabrication of dispersed two-dimensional copper/reduced graphene oxide nanosheets nanocomposites[J].Composites:Part B,2014,58:473-477.
- [29] Pavithra C L P,Sarada B V,Rajulapati K V,et al.A new electrochemical approach for the synthesis of copper-graphene nanocomposite foils with high hardness[J].Scientific Reports,2014(2):1-7.
- [30] Kim B,Im J,Lee B Y.Carbon nanotube-metal nano-laminate for enhanced mechanical strength and electrical conductivity[J].Carbon,2011,49:2549-2554.
- [31] Tsai Y D,Hu C C,Lin C C.Electrodeposition of Sn-Bi lead-free solders:Effects of complex agents on the composition,adhesion,and dendrite formation[J].Electrochimica Acta,2007,53:2040-2047.
- [32] Oxtoby D W.New perspectives on freezing and melting[J].Nature,1990,347:725-730.
- [33] 刘向东.石墨烯增强Sn-Ag-Cu复合无铅钎料的设计与性能研究[D].天津:天津大学,2012.LIU Xiang-dong.Design and property study on a Sn-Ag-Cu lead-free solder reinforced with graphene[D].Tianjin:Tianjin University,2012.
- [34] 韩永典.Ni涂层碳纳米管增强Sn-Ag-Cu无铅钎料的可靠性研究[D].天津:天津大学,2009.HAN Yong-dian.Reliability study on a Sn-Ag-Cu lead free solder reinforced with Ni coated carbon nanotubes[D].Tianjin:Tianjin University,2009.
- [35] 杨中宝.镀镍碳纳米管增强Sn-Ag-Cu无铅焊料的性能研究[D].天津:天津大学,2014.YANG Zhong-bao.Property study of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu lead-free solder[D].Tianjin:Tianjin University,2014.
- [36] Nai S M L,Wei J,Gupta M.Lead-free solder reinforced with multiwalled carbon nanotubes[J].Journal of Electronic Materials,2006,35(7):1518-1522.
- [37] Kumar K M,Kripesh V,Tay A A O.Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders[J].Journal of Alloys and Compounds,2008,450:229-237.
- [38] Chellvarajoo S,Abdullah M Z,Khor C Y.Effects of diamond nanoparticles reinforcement into lead-free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process[J].Materials and Design,2015,82:206-215.
- [39] 安晶.含碳纳米管的Sn-58Bi无铅钎料的制备及其性能研究[D].深圳:哈尔滨工业大学(深圳),2010.AN Jing.Investigations on the preparation method and properties of Sn-58Bi lead-free solder with carbon nanotubes[D].Shenzhen:Harbin Institute of Technology(Shenzhen),2010.
- [40] 何鹏,安晶,马鑫,等.含碳纳米管的Sn-58Bi钎料的制备及其钎焊性[J].焊接学报,2011,32 (9):9-12.HE Peng,AN Jing,MA Xin,et al.Investigation preparation method and soldering behaviors of Sn-58Bi lead-free solder withcarbon nanotubes[J].Transactions of the China Welding Institution,2011,32 (9):9-12.
- [41] Hu X,Chan Y C,Zhang K L,et al.Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electromigration analysis[J].Journal of Alloys and Compounds,2013,580:162-171.
- [42] He P,Lv X C,Lin T S,et al.Improvement of mechanical properties of Sn-58Bi alloy with multi-walled carbon nanotubes[J].Transactions of Nonferrous Metals Society of China,2012,22:S692-S696.
- [43] Ko Yong-Ho,Son Kirak,Kim Gahui,et al.Effects of graphene oxide on the electromigration lifetime of lead-free solder joints[J].Journal of Materials Science:Materials in Electronics,2019,30:2334-2341.
- [44] Nai S M L,Wei J,Gupta M.Effect of carbon nanotubes on the shear strength and electrical resistivity of a lead-free solder[J].Journal of Electronic Materials,2008,37(4):515-522.
- [45] Chen G,Wu F S,Liu C Q,et al.Effects offullerenes reinforcement on the performance of 96.5Sn-3Ag-0.5Cu lead-free solder[J].Materials Science and Engineering A,2015,636:484-492.
- [46] Weber L.Non-conducting inclusions in a conducting matrix:Influence of inclusion size on electrical conductivity[J].Acta Materialia,2005,53:1945-1953.
- [47] Kim S H,Park M,Choi J,Aranas Jr C.Improved electrical and thermo-mechanical properties of a MWCNT/In-Sn-Bi composite solder reflowing on a flexible PET substrate[J].Scientific Reports 2017,7:13756.
- [48] Kim S H,Choi J P,Eom Y S,et al.A phenomenological study of a Sn-Ag-Al composite solder reinforced with Mg-MWCNT:Improved electrical conductivity and thermo-physical performance[J].Materials and Design,2018,140:196-208.
- [49] 龚代涛,刘晓波,王国勇.Sn-Ag-Bi 系钎料焊接性能研究[J].电子元件与材料,2003,22 (7):26-29.GONG Dai-tao,LIU Xiao-bo,WANG Guo-yong.The solderability of the solder based on Sn-Ag-Bi[J].Electronic Componentsand Materials,2003,22 (7):26-29.
- [50] Liu X D,Han Y D,Jing H Y,et al.Effect of grapheme nanosheets reinforcement on the performance of Sn-Ag-Cu lead-free solder[J].Materials Science and Engineering A,2013,562:25-32.
- [51] Yu D Q,Zhao J,Wang L.Improvement on the microstructure stability,mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements[J].Journal of Alloys and Compounds,2004,376:170-175.
- [52] Han Y D,Jing H Y,Nai S M L,et al.Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling[J].Intermetallics,2012,31:72-78.
- [53] Han Y D,Nai S M L,Jing H Y,et al.Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes[J].Journal of Materials Science:Materials in Electronics,2011,22:315-322.
- [54] Han Y D,Jing H Y,Nai S M L,et al.Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes[J].Journal of Materials Science:Materials in Electronics,2012,23:1108-1115.
- [55] Han Y D,Gao Y,Zhang S T,et al.Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation[J].Materials Science and Engineering A,2019,761:138051.
- [56] Fan Y C,Lgarashi G,Jiang W,et al.Highly strain tolerant and tough ceramic composite by incorporation of graphene[J].Carbon,2015,90:274-283.
- [57] Zhang Z,Chen D L.Consideration of Orowan strengthening effect in particulate-reinforced metal matrix nanocomposites:a model for predicting their yield strength[J].Scripta Materialia,2006,54:1321-1326.
- [58] Kombaiah B,Murty K L.Coble,orowan strengthening,and dislocation climb mechanisms in a Nb-modified zircaloy cladding[J].Metallurgical and Materials Transactions A,2015,46:4646-4660.
- [59] Liu H,Gao Y P,Qi L,et al.Phase-field simulation of orowan strengthening by coherent precipitate plates in an aluminum alloy[J].Metallurgical and Materials Transactions A,2015,46:3287-3301.
- [60] Li J F,Zhang L,Xiao J K,et al.Sliding wear behavior of copper-based composites reinforced with graphene nanosheets and graphite[J].Transactions of Nonferrous Metals Society of China,2015,25:3354-3362.
- [61] Peng Y T,Deng K.Study on the mechanical properties of the novel Sn-Bi/Graphene nanocomposite by finite element simulation[J].Journal of Alloys and Compounds,2015,625:44-51.
- [62] Nai S M L,Wei J,Gupta M.Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites[J].Thin Solid Films,2006,504:401-404.
- [63] Yang Z B,Zhou W,Wu P.Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn-Ag-Cu solder alloys[J].Materials Science and Engineering A,2014,590:295-300.
- [64] Xu L Y,Wang L X,Jing H Y,et al.Effects of graphene nanosheets on interfacial reaction of Sn-Ag-Cu solder joints[J].Journal of Alloys and Compounds,2015,50:475-481.
- [65] 黄松林.硼酸铝晶须及多孔陶瓷的制备和性能研究[D].武汉:武汉理工大学,2006.HUANG Song-lin.Preparation and performance of aluminium borate whisker and porous ceramic[D].Wuhan:Wuhan University of Technology,2006.
- [66] 翟鸿祥,袁泉,黄勇,等.SiC晶须及原位增强Si3N4基复合材料的断裂过程[J].硅酸盐学报,1998,26 (5):571-577.ZHAI Hong-xiang,YUAN Quan,HUANG Yong,et al.Fracture process of SiC whisker reinforced and in-situ reinforced Si3N4composites[J].Journal of the Chinese Ceramic Society,1998,26 (5):571-577.
- [67] Kumar K M,Kripesh V,Tay A A O.Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn-Pb solder alloy[J].Journal of Alloys and Compounds,2008,455:148-158.
- [68] Iijima S.Helical microtubules of graphitic carbon[J].Nature,1991,354:56-58.
- [69] 杨明,韩蓓蓓,马鑫,等.纳米无铅焊料的研究进展[J].电子工艺技术,2014,35 (1):1-7.YANG Ming,HAN Bei-bei,MA Xin,et al.Current status of nanolead-free solder alloys[J].Electronics Process Technology,2014,35 (1):1-7.
- [70] Zhang L,Tu K N.Structure and properties of lead-free solders bearing micro and nano particles[J].Materials Science and Engineering R,2014,82:1-32.
- [71] 张亮,Tu K N,孙磊,等.纳米-微米颗粒增强复合钎料研究最新进展[J].中南大学学报 (自然科学版),2015,46 (1):49-64.ZHANG Liang,Tu K N,SUN Lei,et al.Reviews on latest advances in micro/nano-sized particles enhanced composite solders[J].Journal of Central South University (Science and Technology),2015,46 (1):49-64.
- [72] 修子扬,武高辉,黄亦龙,等.一种高导热石墨烯-Sn-Ag系复合钎料的制备方法:中国,CN104400247A[P] 2014-03-11.
- [73] 马运柱,李永君,刘文胜.纳米颗粒增强无铅复合焊料的研究现状[J].电子元件与材料,2011,30 (6):79-83.MA Yun-zhu,LI Yong-jun,LIU Wen-sheng.Research development of nano-composite lead-free solders[J].Electronic Components and Materials,2011,30 (6):79-83.
- [74] 尹立孟,杨艳,刘亮岐,等.电子封装微互连焊点力学行为的尺寸效应[J].金属学报,2009,45 (4):422-427.YIN Li-meng,YANG Yan,LIU Liang-qi,et al.Size effect of mechanical behavior of minia-true solder joint interconnections inelectronic packaging[J].Acta Metallurgica Sinica,2009,45 (4):422-427.
- [75] 苌文龙,于治水,房加强,等.尺寸效应下的无铅微焊点研究进展[J].上海工程技术大学学报,2012,26 (2):111-114.CHANG Wen-long,YU Zhi-shui,FANG Jia-qiang,et al.Research status of lead-free micro-bump under size effect[J].Journal ofShanghai University of Engineering Science,2012,26 (2):111-114.
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